Koytepe, SueleymanKucuk, IlhanSeckin, TurgayAdiguzel, H. Ibrahim2024-08-042024-08-0420150360-25591525-6111https://doi.org/10.1080/03602559.2015.1010216https://hdl.handle.net/11616/97020Novel low dielectric polyimide-SiO2 hybrid materials containing bipyridine were prepared with three-step sol-gel process from poly(amic acid)s. (3-Aminopropyl)triethoxysilane as coupling agent was used to increase the intrachain chemical bonding between the polyimide and SiO2 groups. The thermal, dielectric, and physical properties of the hybrid materials were investigated and correlated with the porous structure. The glass transition temperatures of all the hybrids were found to be higher than polyimides. The effect of SiO2 groups on the porous structure and dielectric properties was investigated. The dielectric constant of the hybrid materials was observed a decrease from 3.30 to 2.15 with increased SiO2 amount.eninfo:eu-repo/semantics/closedAccessHybrid materialsLow dielectric propertiesPolyimideSiO2Article54121251126210.1080/03602559.2015.10102162-s2.0-84944880216N/AWOS:000362613600001Q3