Koytepe, SuleymanAdiguzel, H. IbrahimSeckin, Turgay2024-08-042024-08-0420090925-83881873-4669https://doi.org/10.1016/j.jallcom.2008.02.085https://hdl.handle.net/11616/94743Polyimides embedding the nickelocene unit were prepared by in situ curing of poly(amic acid) macromolecules with nickelocene, for the molecular-level design of low-dielectric constant (IOW-kappa) materials. The effects of nickelocene on dielectric properties of polyimide are investigated in detail in this study. Nickelocene containing polyimides exhibit a number of desirable properties including low-water absorption and admirable thermal stability. Systematic studies demonstrate that proper insertion of nickelocene into a polyimide backbone can give rise to a reduction in the material's dielectric constant. All composites were subjected to DSC measurements for the purpose of examining microscopic miscibility. DSC thermograms of all composites showed only one T-g from all composition. (C) 2008 Elsevier B.V. All rights reserved.eninfo:eu-repo/semantics/closedAccessComposite materialsInorganic materialsChemical synthesisDielectric responseThermal analysisArticle4701-234735310.1016/j.jallcom.2008.02.0852-s2.0-59249107213Q1WOS:000263975100074Q1