Porous pyridine based polyimide-silica nanocomposites with low dielectric constant
Küçük Resim Yok
Tarih
2013
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Springer
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Highly porous polymer-silica hybrid materials were prepared based on the organo-soluble polyimides of four various dianhydride and 2,5-diaminopyridine. 3-Aminopropyltriethoxysilane (APS) was used to increase the intrachain chemical bonding and interchain hydrogen bonding between the polyimide and silica moieties, respectively. The chemical interaction would significantly affect the morphologies and properties of the prepared films. The produced polyimide-silica composites were investigated by X-ray diffraction analysis, scanning electron microscope and thermal analysis tecniques. The effect of silica modified with functional group of 3-aminopropyltriethoxy silane on the porous structure and dielectric properties as well as the thermal stability of films were investigated. Capacitances were determined with a HP4294A at a frequency between 1 kHz and 1 MHz. The dielectric constant was significantly reduced with increasing silica modified with APS. The result indicates that the composite materials are potentially useful in low dielectric materials.
Açıklama
Anahtar Kelimeler
Polyimide, Porous material, Silica, Composites, Dielectric properties
Kaynak
Journal of Porous Materials
WoS Q Değeri
Q3
Scopus Q Değeri
Q2
Cilt
20
Sayı
4