Porous pyridine based polyimide-silica nanocomposites with low dielectric constant

Küçük Resim Yok

Tarih

2013

Dergi Başlığı

Dergi ISSN

Cilt Başlığı

Yayıncı

Springer

Erişim Hakkı

info:eu-repo/semantics/closedAccess

Özet

Highly porous polymer-silica hybrid materials were prepared based on the organo-soluble polyimides of four various dianhydride and 2,5-diaminopyridine. 3-Aminopropyltriethoxysilane (APS) was used to increase the intrachain chemical bonding and interchain hydrogen bonding between the polyimide and silica moieties, respectively. The chemical interaction would significantly affect the morphologies and properties of the prepared films. The produced polyimide-silica composites were investigated by X-ray diffraction analysis, scanning electron microscope and thermal analysis tecniques. The effect of silica modified with functional group of 3-aminopropyltriethoxy silane on the porous structure and dielectric properties as well as the thermal stability of films were investigated. Capacitances were determined with a HP4294A at a frequency between 1 kHz and 1 MHz. The dielectric constant was significantly reduced with increasing silica modified with APS. The result indicates that the composite materials are potentially useful in low dielectric materials.

Açıklama

Anahtar Kelimeler

Polyimide, Porous material, Silica, Composites, Dielectric properties

Kaynak

Journal of Porous Materials

WoS Q Değeri

Q3

Scopus Q Değeri

Q2

Cilt

20

Sayı

4

Künye