Effect of Plasma Deposited Thin Carbon Layer on Dielectric Characteristics of Au-PI-Au Structures
Küçük Resim Yok
Tarih
2012
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Ieee-Inst Electrical Electronics Engineers Inc
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
In this study, dielectric properties of a virgin polyimide (PI) sample and tailored PI sample are investigated in a metal-insulator-metal (MIM) structure comparatively. In order to modify the dielectric properties of the tailored sample, plasma enhanced chemical vapor deposition (PECVD) method was used, and a thin a-C:H layer was deposited on the sample surface. Then dielectric permittivity, dielectric loss and ac conductivity characteristics, which were calculated according to the measured capacitance, loss factor and conductance values, were plotted versus frequency (0.1-100 kHz) and temperature (20-300 degrees C). Also, SEM images and FTIR spectrum of the samples were presented and evaluated. Consequently, a-C:H layer and accompanying plasma polymer interactions during PECVD led to decrease the permittivity of the sample, and increase the thermal stability of the tailored sample relatively.
Açıklama
Anahtar Kelimeler
Dielectric films, MIM structures, dielectric materials, dielectric measurements, polyimide films, permittivity, plasma CVD
Kaynak
Ieee Transactions on Dielectrics and Electrical Insulation
WoS Q Değeri
Q2
Scopus Q Değeri
Q1
Cilt
19
Sayı
6
