Effect of Plasma Deposited Thin Carbon Layer on Dielectric Characteristics of Au-PI-Au Structures

Basit Öğe Kaydı
dc.authoridKoseoglu, Murat/0000-0003-3774-1083
dc.authoridHafiz, Alisoy/0000-0003-4374-9559
dc.authorwosidKoseoglu, Murat/ABG-8975-2020
dc.authorwosidHafiz, Alisoy/ABA-7256-2020
dc.contributor.authorKoseoglu, Murat
dc.contributor.authorAlisoy, Hafiz Z.
dc.date.accessioned2024-08-04T20:37:23Z
dc.date.available2024-08-04T20:37:23Z
dc.date.issued2012
dc.departmentİnönü Üniversitesien_US
dc.description.abstractIn this study, dielectric properties of a virgin polyimide (PI) sample and tailored PI sample are investigated in a metal-insulator-metal (MIM) structure comparatively. In order to modify the dielectric properties of the tailored sample, plasma enhanced chemical vapor deposition (PECVD) method was used, and a thin a-C:H layer was deposited on the sample surface. Then dielectric permittivity, dielectric loss and ac conductivity characteristics, which were calculated according to the measured capacitance, loss factor and conductance values, were plotted versus frequency (0.1-100 kHz) and temperature (20-300 degrees C). Also, SEM images and FTIR spectrum of the samples were presented and evaluated. Consequently, a-C:H layer and accompanying plasma polymer interactions during PECVD led to decrease the permittivity of the sample, and increase the thermal stability of the tailored sample relatively.en_US
dc.description.sponsorshipInonu University Research Fund for the Doctoral Program of Higher Education [2008/40]en_US
dc.description.sponsorshipThe authors gratefully acknowledge the support from Inonu University Research Fund for the Doctoral Program of Higher Education (Grant No. 2008/40).en_US
dc.identifier.doi10.1109/TDEI.2012.6396974
dc.identifier.endpage2144en_US
dc.identifier.issn1070-9878
dc.identifier.issn1558-4135
dc.identifier.issue6en_US
dc.identifier.scopus2-s2.0-84872165072en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.startpage2137en_US
dc.identifier.urihttps://doi.org/10.1109/TDEI.2012.6396974
dc.identifier.urihttps://hdl.handle.net/11616/95915
dc.identifier.volume19en_US
dc.identifier.wosWOS:000313457200036en_US
dc.identifier.wosqualityQ2en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherIeee-Inst Electrical Electronics Engineers Incen_US
dc.relation.ispartofIeee Transactions on Dielectrics and Electrical Insulationen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectDielectric filmsen_US
dc.subjectMIM structuresen_US
dc.subjectdielectric materialsen_US
dc.subjectdielectric measurementsen_US
dc.subjectpolyimide filmsen_US
dc.subjectpermittivityen_US
dc.subjectplasma CVDen_US
dc.titleEffect of Plasma Deposited Thin Carbon Layer on Dielectric Characteristics of Au-PI-Au Structuresen_US
dc.typeArticleen_US

Dosyalar

Koleksiyon

WoS İndeksli Yayınlar Koleksiyonu
Scopus İndeksli Yayınlar Koleksiyonu